CPU 2 x A78 2.0~2.2G, 6 x A55 1.8~2.0G
GPU Mali-G57 MC2, 35fps
NPU MTK NPU 850, NPU/9, Total/10 TOPS
Video Input 1x ISP, 16MP@30fps Up to 1x 4K60 or 6x FHD30 via MIPI Virtual Channels，2x MIPI-CSI (C/D-PHY, 4L 2.5Gbps/L)
Camera features 3A, NR, AI-FD, WPE, LSC ;Storage UFS3.1
Display Single Display: Max. UW5K60 (5120x2160) or 4K60 (3840x2160) Dual Display: Max. 2.5K60 + 2.5K60 (2560x1600)
Video Decode 4K60 H.265/H.264/VP9;Video Encode 4K30 H.265/H.264
Audio 2x I2S/TDM (2ch, 2 in(Master/Slave), 2 out(Master)) (32b @192KHz) 1x PCM (2ch), 2x PDM(2ch) (24b @48KHz)
I/O 1x PCIe Gen 2 (RC, support WoW) 2x USB3.2 Gen 1 Type-C (1x dual mode share with DP1.4, 1x host, 64EP) 3x USB2.0 (host, 64EP), 4x UART, 6x SPI, 9x I2C, 1x GbE MAC (TSN), 3x SDIO3.0 (8-bit/4-bit/4-bit)
WIFI Baseband WiFi-6 ;OSM Size Size-L 45mmx45mm
CPU： 2 x A78 2.4~2.6G,6 x A55 2.0G GPU： Mali-G57 MC2, 42fps NPU： MTK NPU 850, NPU/9, Total/10 TOPS
Video Input：2x ISP, 16+16MP or 32MP@30fps Up to1x 4K60 or 6x FHD30 via MIPI VirtualChannels, 2x MIPI-CSI (C/D-PHY 4L2.5Gbps/L) Camera features::3A, NR, AI-FD, WPE, LSC
Memory:32-bit LP5-6400 up to 16GB Storage: UFS3.1
Display :Single Display: Max. UW5K60(5120x2160) or 4K60 (3840x2160)Dual Display: Max. 2.5K60 + 2.5K60(2560x1600)
Video Decode :4K60 H.265/H.264/VP9 Video Encode:4K30 H.265/H.264 JPEG Dec/Enc:250/250 MP/s
Audio :2x I2S/TDM (2ch, 2 in(Master/Slave), 2out(Master)) (32b @192KHz)1x PCM (2ch),2x PDM(2ch)(24b@48KHz
I/O :1x PCle Gen 2 (RC, support WoW)2x USB3.2 Gen 1 Type-C (1x dual modeshare with DP1.4, 1x host, 64EP)3x USB2.0 (host, 64EP), 4x UART, 6xSPI, 9x I2C, 1x GbE MAC (TSN), 3xSDIO3.0 (8-bit/4-bit/4-bit)
WIFI Baseband:WiFi-6
OSM Size:Size-L 45mmx45mm
Imaging Array: 320 x 240 Array Flexible ROl 1/3 Optical Format
Pixel Pitch: 15 um
Frame Rate: 5~120 fps
Control Interface: CCl(l2C)
Data Interface: MlPl CS1-2
3.3v Single Power Supply
Low Power Consumption with Scalability <100mw @ 30fps
Leading Accuracy in the Industry ≤ 1% of Distance (0.15m~5m @ 30fps)
Pixel size: 7.0umx7.0um
Resolution: 640Hx480V
Pixel array:648Hx487V
Frame rate: 10~60fps
Effective image size: 4,480umx3,360um
Optical format: 1/3 inch
Analog power supply: 3.3V
Host interface: CCl(l2C standard)orSPI(Mode3)
Process12nm CPU 4xCortex-A53 2.0GHz Camera Video decode
存储 PDDR3&LPDDR4X UPto 4GBeMMC5.1
Camera 2* CSI-2 4lane21MP@30fps13MP+8MP@30fps
Video decode 1080p 30fpsH.264/HEVC Video encode 1080p 30fps H.264 Display MIP1. 19201080
Connectivity MT6631N3合1,支持802.11 a/b/g/n/ac2.4G和5G双频段) BT5.2 GPS/Beidou/Galileo/GIonass支持双星系统
Modem FDD/TDD LTE CAT4,WCDMA/TD-SCDMA/GSM94000左右
AnTuTu benchmark score around 94,000
四核MT8766B LPDDR3&LPDDR4LGA+LCC封装 全球频段 40.5MM×40.5MM单屏，HD+
产品简介 Z700-H 模组是芯发科技推出的 4G 智能模组，遵守 3GPP 规范。 ⚫ 支持 LTE-TDD/LTE-FDD/WCDMA/GSM 制式； ⚫ 支持 2.4GHz/5GHz 双频 Wi-Fi，BT5.2 近距离无线传输技术； ⚫ 支持 GNSS 无线定位技术； ⚫ 产品采用射频基带一体化设计，具有高集成度、封装尺寸小和高可靠性的特点；
模组主要性能参数 Feature Details CPU MT8786,12nm Octa-core two ARM® Cortex-A75 2.0GHz+six ARM® Cortex-A55 1.8GHz GPU G52 MC2 950MHz 软件升级 USB/OTA/SD card RAM 支持 LPDDR4x，最高支持到 8GB eMMC 支持 eMMC5.1
关键特性 Z700-H 模组采用 LCC+LGA 封装设计，尺寸仅为 40.5x40.5x2.8mm，可运行安卓 12/13/14 操作系 统，性能强大，可满足客户在各商业领域中对高速率和长生命周期的需求
模组集成功能丰富的接 口，如 LCM、摄像头、触摸屏、麦克风、Line Out、UART、USB、I2C 以及 SPI 接口等，适用于金融智 能 POS、手持 PDA、收银机等智能产品。
