G720 Module
CPU: 2 x A78 2.4~2.6G,6 x A55 2.0G
GPU: Mali-G57 MC2, 42fps
NPU: MTK NPU 850, NPU/9, Total/10 TOPS
Video Input:2x ISP, 16+16MP or 32MP@30fps Up to1x 4K60 or 6x FHD30 via MIPI VirtualChannels, 2x MIPI-CSI (C/D-PHY 4L2.5Gbps/L)
Camera features::3A, NR, AI-FD, WPE, LSC
Memory:32-bit LP5-6400 up to 16GB
Storage: UFS3.1
Display :Single Display: Max. UW5K60(5120×2160) or 4K60 (3840×2160)Dual Display: Max. 2.5K60 + 2.5K60(2560×1600)
Video Decode :4K60 H.265/H.264/VP9
Video Encode:4K30 H.265/H.264
JPEG Dec/Enc:250/250 MP/s
Audio :2x I2S/TDM (2ch, 2 in(Master/Slave), 2out(Master)) (32b @192KHz)1x PCM (2ch),2x PDM(2ch)(24b@48KHz
I/O :1x PCle Gen 2 (RC, support WoW)2x USB3.2 Gen 1 Type-C (1x dual modeshare with DP1.4, 1x host, 64EP)3x USB2.0 (host, 64EP), 4x UART, 6xSPI, 9x I2C, 1x GbE MAC (TSN), 3xSDIO3.0 (8-bit/4-bit/4-bit)
WIFI Baseband:WiFi-6
OSM Size:Size-L 45mmx45mm
1:芯发科技G系列的主要特点
① 方案先进,领先竞争对手一两代。
② 高性能,低价格:整体售价远低于同档高通、NXP、RK。
③ 低功耗:4纳米、6纳米制程,功耗超低,特别适合做手持产品,做桌面产品是降维打击。
④ 原生接口丰富:多个USB口/双屏、三屏等。
⑤ 软件系统稳定,安卓升级快。有安卓和LINUX双系统。
⑥ 如果用模组,整合度高,整合了MTK套片、DDR和EMMC,客户不用自己花太多精力处理研发和供应链工作。
⑦ 如果用模组,符合OSM协议,开发上手快,通用性高。https://sget.org/standards/osm/ *AI算力模组系列无蜂窝能力。
2:适合的设备类型 • 闺蜜机 • 健身镜 • 收银机 • 智能称 • 工业平板 • 具身智能 • 工控机
3:G720 module is the standard module of OSM (Open Standard Module) specification launched by Zelus(Shenzhen) Technology, with the size of 45mm X 45mm 662Pin.
CPU: 2 x A78 2.4~2.6G,6 x A55 2.0G
GPU: Mali-G57 MC2, 42fps
NPU: MTK NPU 850, NPU/9, Total/10 TOPS
Video Input:2x ISP, 16+16MP or 32MP@30fps Up to1x 4K60 or 6x FHD30 via MIPI VirtualChannels, 2x MIPI-CSI (C/D-PHY 4L2.5Gbps/L)
Camera features::3A, NR, AI-FD, WPE, LSC
Memory:32-bit LP5-6400 up to 16GB
Storage: UFS3.1
Display :Single Display: Max. UW5K60(5120x2160) or 4K60 (3840x2160)Dual Display: Max. 2.5K60 + 2.5K60(2560x1600)
Video Decode :4K60 H.265/H.264/VP9
Video Encode:4K30 H.265/H.264
JPEG Dec/Enc:250/250 MP/s
Audio :2x I2S/TDM (2ch, 2 in(Master/Slave), 2out(Master)) (32b @192KHz)1x PCM (2ch),2x PDM(2ch)(24b@48KHz
I/O :1x PCle Gen 2 (RC, support WoW)2x USB3.2 Gen 1 Type-C (1x dual modeshare with DP1.4, 1x host, 64EP)3x USB2.0 (host, 64EP), 4x UART, 6xSPI, 9x I2C, 1x GbE MAC (TSN), 3xSDIO3.0 (8-bit/4-bit/4-bit)
WIFI Baseband:WiFi-6
OSM Size:Size-L 45mmx45mm

Mark:SoC PN, process :MT8391AV,6nm